Method of producing processing condition of plasma processing apparatus, and plasma processing apparatus

A plasma processing apparatus comprising:

• a high frequency wave supply unit configured to supply a high frequency wave;
• and
• a control unit configured to:
• produce a plurality of processing conditions having different processing parameters, which are applied to an intermediate process performed between an ignition process that ignites plasma of a processing gas using a high frequency wave and a processing process that processes a workpiece by the plasma;
• sequentially perform the ignition process, the intermediate process applied with each of the processing conditions, and the processing process;
• measure, when the intermediate process is changed to the processing process, a power of a reflected wave of the high frequency wave during the processing process in association with each of the processing conditions;
• and selects, among the plurality of processing conditions, a processing condition in which the power of the reflected wave of the high frequency wave is minimized,
• wherein the plasma processing apparatus includes a storage unit configured to store a recipe used when the ignition process, the intermediate process, and the processing process are performed, and the selecting rewrites the recipe such that the selected processing condition is applied to the intermediate process.