Chip resistor and mounting structure thereof
AssigneeRohm Co., Ltd.
InventorMasaki Yoneda
Life of this patent
Estimating the term…
Abstract
A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.
Claims19
A method of making a chip resistor, the method comprising the steps of:
- forming an insulating layer on an obverse surface of a resistor board;
- forming a conducting layer that flanks the insulating layer on the obverse surface of the resistor;
- forming an electroconductive underlying layer on the obverse surface of the resistor board on which the conducting layer was formed, in a manner such that the underlying layer covers a part of the insulating layer;
- forming a plating layer on the obverse surface of the resistor board in a manner such that the plating layer covers the underlying layer;
- and
- collectively cutting through the plating layer, the underlying layer and the resistor board at a position spaced apart from the insulating layer as viewed in a thickness direction of the resistor board.
Dependencies are inferred from the claim text.