# US 9,870,529 B1 · Transponder wire bonded to round wire on adhesive tape having a water-soluble backing

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- Number: US 9,870,529 B1
- Document ID: US9870529B1
- Status: Granted
- Kind: B1
- Application number: 15/416,664
- Filed: 2017-01-26
- Granted: 2018-01-16
- Earliest claimed: 2017-01-26
- Assignees: Automated Assembly Corporation
- Applicants: Automated Assembly Corporation
- Inventors: Robert Neuman
- Web page: https://patentgrep.com/patent/US9870529B1

## CPC

- G06K 19/0775: {arrangements for connecting the integrated circuit to the antenna}
- H10W 72/50: Bond wires
- G06K 19/07747: {at least one of the integrated circuit chips being mounted as a module}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/181: associated with surface mounted components
- H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
- H05K 3/32: electrically connecting electric components or wires to printed circuits
- H05K 3/328: by welding
- H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)}
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A disclosed transponder arrangement includes a water soluble backing having first and second major surfaces. A layer of pressure sensitive adhesive (PSA) has a third major surface and a fourth major surface. The fourth major surface is directly adhered to the first major surface of the water soluble backing. One or more metal foil pads are attached directly on the third major surface of the layer of PSA. Electrically conductive round wire is attached directly on the third major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the metal foil pad(s) with weld joint(s). An RF transponder is attached directly on the third major surface of the first layer of PSA and is electrically connected to the one or more portions of the round wire by bond wire(s).

## Claims

### Claim 1

A circuit arrangement, comprising:
a water soluble backing having first and second major surfaces, the first major surface opposite the second major surface;
a layer of pressure sensitive adhesive (PSA) having a third major surface and a fourth major surface, the third major surface opposite the fourth major surface, and the fourth major surface directly adhered to the first major surface of the water soluble backing;
one or more metal foil pads attached directly on the third major surface of the layer of PSA;
electrically conductive round wire attached directly on the third major surface of the layer of PSA, the wire having a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively; and
an RF transponder attached directly on the third major surface of the layer of PSA and electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

### Claim 2 (depends on 1)

The circuit arrangement of claim 1, wherein the one or more bond wires are directly connected to the one or more portions of the round wire.

### Claim 3 (depends on 1)

The circuit arrangement of claim 1, wherein the one or more bond wires are directly connected to the one or more metal foil pads, respectively.

### Claim 4 (depends on 1)

The circuit arrangement of claim 1, wherein each of the one or more portions of round wire have flat contact areas with the respective one of the one or more metal foil pads.

### Claim 5 (depends on 1)

The circuit arrangement of claim 1, wherein:
each of the one or more portions of round wire has a flat area of contact with the respective one of the one or more metal foil pads; and
each of the one or more portions of round wire has a flat area of contact to which the respective one of the one or more bond wires is directly connected.

### Claim 6 (depends on 1)

The circuit arrangement of claim 1, wherein each of the one or more metal foil pads is directly electrically connected to only one of the one or more portions of round wire.

### Claim 7 (depends on 1)

The circuit arrangement of claim 1, wherein each of the one or more metal foil pads is directly electrically connected to only one of the one or more portions of round wire and one of the one or more bond wires.

### Claim 8 (depends on 1)

The circuit arrangement of claim 1, further comprising a polymer conformal coating that covers the one or more metal foil pads and the RF transponder.

### Claim 9 (depends on 1)

The circuit arrangement of claim 1, further comprising a release liner disposed directly on the layer of PSA.

### Claim 10

A method of making a circuit arrangement, comprising:
attaching first and second metal foil pads to a layer of pressure sensitive adhesive (PSA) that is disposed on a water soluble backing;
attaching a radio frequency (RF) transponder to the layer of PSA proximate the first and second metal foil pads;
attaching antenna wire to the layer of PSA, the antenna wire having a round cross section and first and second portions disposed over the first and second metal foil pads, respectively;
welding the first and second portions of the antenna wire to the first and second metal foil pads, respectively; and
wire bonding the RF transponder to the first and second portions of the antenna wire making first and second wire bond joints between first and second bond wires and the first and second portions of the antenna wire, respectively.

### Claim 11 (depends on 10)

The method of claim 10, further comprising:
compressing each of the first and second portions of the antenna wire into flat contact areas with the first and second metal foil pads, respectively; and
wherein the wire bonding includes making the first and second wire bond joints between the first and second bond wires and compressed parts of the first and second portions of the antenna wire.

### Claim 12 (depends on 10)

The method of claim 10, wherein the first and second metal foil pads are directly electrically connected to only the first and second portions, respectively, of the antenna wire.

### Claim 13 (depends on 10)

The method of claim 10, further comprising forming a polymer conformal coating that covers the first and second metal foil pads and the RF transponder.

### Claim 14 (depends on 13)

The method of claim 13, further comprising attaching a release liner directly on the layer of PSA and over the polymer conformal coating.

### Claim 15 (depends on 10)

The method of claim 10, wherein the water soluble backing includes poly vinyl alcohol.