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US 9,870,035 B2Granted
Device for high density connections
AssigneeInternational Business Machines Corporation
InventorsRobert Birke, Yiyu L. Chen, Martin L. Schmatz
Life of this patent
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AssigneeInternational Business Machines Corporation
InventorsRobert Birke, Yiyu L. Chen, Martin L. Schmatz
Estimating the term…
A device is described. The device includes a daughterboard having a first distinct side and a second distinct side. A first connector on the first distinct side is attached to a first baseboard. A second connector on the second distinct side is attached to a second baseboard. A method for attaching a daughterboard to a second device is described. Connectors are included on opposing distinct sides of the daughterboard. The second device includes baseboards mechanically secured in parallel by lead screw actuators. As part of the method, the lead screw actuators are actuated so as to move the baseboards away from each other. A first connector is attached to one of the baseboards. The lead screw actuators are again actuated so as to move the baseboards toward each other until a second connector is brought into attachment with the other of the baseboards.
A device comprising:
A method for attaching a daughterboard to a device, the daughterboard including a first electrical connector on a first distinct side of the daughterboard and a second electrical connector on a second distinct side of the daughterboard opposite the first distinct side, the device including a first baseboard mechanically secured in parallel with a second baseboard by one or more lead screw actuators, the first baseboard comprising a first processor communicatively coupled with a first memory, the second baseboard comprising a second processor communicatively coupled with a second memory, the method comprising:
Dependencies are inferred from the claim text.