Array substrate and method of manufacturing the same, and display device

A method of manufacturing an array substrate, comprising steps of:

• forming a display area and a non-display area on a substrate, a circuit bonding area being arranged within the non-display area;
• forming an alignment film in the display area through a patterning process;
• forming, through a patterning process, a transparent protection layer at least in a portion of the non-display area other than the circuit bonding area;
• and
• forming, through a rubbing-imprinting process, a plurality of lines having the same orientation on a surface of the alignment film, for an ordered arrangement of liquid crystal molecules,
• wherein a surface height of the transparent protection layer is lower than or equal to a surface height of the alignment film;
• and
• wherein the steps of forming the alignment film and the transparent protection layer comprise:
• coating a first resin layer on a surface of the substrate having the display area and the non-display area;
• coating a second resin layer on the first resin layer;
• forming a photoresist layer on a surface of the second resin layer;
• forming, through a single masking and exposing process and a single development process, a second full coverage area of the photoresist layer, a second full removal area of the photoresist layer, and a partial removal area of the photoresist layer, the second full coverage area of the photoresist layer corresponding to the alignment film to be formed, the second full removal area of the photoresist layer corresponding to the circuit bonding area, and the partial removal area of the photoresist layer corresponding to the transparent protection layer to be formed;
• etching a portion of the second resin layer and a portion of the first resin layer corresponding to the second full removal area of the photoresist layer;
• ashing a portion of the photoresist in the partial removal area of the photoresist layer, and etching a portion of the second resin layer corresponding to the partial removal area of the photoresist layer;
• and
• peeling off a portion of the photoresist within the second full coverage area of the photoresist layer, so that a remaining portion of the first resin layer forms the transparent protection layer.