Method for processing ceramic scintillator array

A method for processing a ceramic scintillator array, comprising:

• (a) forming, in a first direction, a predetermined number of straight first-direction through-cuts which are parallel to each other and spaced from each other on a scintillator substrate by using a laser beam;
• (b) adequately filling the first-direction through-cuts with an adhesive and solidifying the adhesive;
• (c) forming, in a second direction, a predetermined number of second direction through-cuts which are parallel to each other at a predetermined interval on the scintillator substrate by using the laser beam, wherein the second direction is perpendicular to the first direction;
• (d) adequately filling the second direction through-cuts with the adhesive and solidifying the adhesive;
• (e) polishing both end surfaces of the scintillator substrate until the scintillator substrate has a required thickness;
• and
• (f) cutting the scintillator substrate, with a circular diamond blade, into narrow bars along the cuts formed by laser cutting process, wherein each narrow bar has a predetermined number of rows.