Method and system for detecting defects of wafer by wafer sort

A method for detecting defects of wafer by wafer sort, comprising:

• a. using an E-beam inspection apparatus to obtaining a plurality of raw images of a wafer;
• b. outputting a plurality of physical coordinates within the wafer by decoding a plurality of locations of the raw images;
• c. providing a wafer sort testing apparatus, wherein the wafer sort testing apparatus comprises a wafer prober, a data processing module coupled to the wafer prober, and an output module coupled to the data processing module;
• d. using the wafer prober to test a wafer for obtaining a plurality of physical locations of repaired sites;
• e. using the data processing module to highlight the plurality of repaired sites obtained from the wafer prober;
• f. using the display to show a defect signature from the plurality of physical locations of the repaired sites at step e, wherein the defect signature is reported by different color, and one color represents one type of the defects;
• g. using the output module to output the plurality of physical locations of the repaired sites highlighted by the data processing module;
• and
• h. using an analysis equipment to match the output physical coordinates within the wafer with the physical locations of the repaired sites so as to generate a data correlating with defects at the repaired sites.

A system for detecting defects of a wafer, comprising:

• a design layout database unit storing a graphic data system (GDS) design layout coordinate of the wafer;
• an analysis equipment coupled to the design layout database unit;
• and
• a wafer sort (WS) testing apparatus coupled to the analysis equipment and comprising:
• a wafer prober for testing the wafer to obtain a plurality of physical locations of repaired sites;
• a data processing module coupled to the wafer prober and highlighting the plurality of repaired sites obtained from the wafer prober;
• a display coupled to the data processing module and showing a defect signature from the plurality of physical locations of the repaired sites, wherein the defect signature is reported by different color, and one color represents one type of the defects;
• and
• an output module coupled to the data processing module and outputting the plurality of physical locations of the repaired sites into the analysis equipment, such that the GDS design layout coordinate is matched with the output physical locations of the repaired sites by the analysis equipment so as to generate a data correlating with defects at the repaired sites.