Wiring substrate with filled vias to accommodate custom terminals

A process for providing a custom electrically conductive terminal on a first surface of a wiring substrate, wherein said wiring substrate comprises electrically conductive vias from said first surface to an opposite surface of said wiring substrate, said process comprising:

• forming a hole at a first one of said vias from said first surface into said wiring substrate and thereby removing all electrically conductive material of said first via in a gap from said first surface into said wiring substrate;
• depositing an electrically insulating material into said hole such that said electrically insulating material is disposed between all remaining electrically conductive material of said first via and said first surface of said wiring substrate;
• and
• providing on said first surface of said wiring substrate and said insulating material said custom terminal such that said custom terminal overlaps said first via without electrically contacting said first via and such that said custom terminal overlaps said second via and electrically contacts said second via.