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US 9,869,598 B1Granted
Low cost small force sensor
AssigneeHoneywell International Inc.
InventorsRichard Wade, Alistair David Bradley
Life of this patent
Estimating the term…
Abstract
Disclosed herein are force sensors which include a sense die assembly and methods for manufacturing the sense die assembly and the force sensor. The disclosed sense die assembly, force sensor, and methods utilize wafer-level retention to hold an actuation element in a cavity of the sense die.
Claims16
A force sensor comprising:
- a substrate;
- a sense die having a top side and a bottom side, wherein the sense die includes a cavity formed therein and a diaphragm, and one or more sensing elements positioned on a bottom side of the diaphragm, wherein the bottom side of the sense die is flip chip bonded to the substrate;
- an actuation element placed in the cavity of the sense die and in contact with a top side of the diaphragm and with a wall of the cavity;
- and
- a cover member positioned on the top side of the sense die, wherein the cover member includes an opening positioned over the cavity of the sense die, wherein the actuation element extends through the opening, wherein the cover member holds the actuation element within the cavity.
2 more elements
A sense die assembly comprising:
- a sense die having a top side and a bottom side, wherein the sense die includes a cavity and a diaphragm formed therein by etching, and one or more sensing elements positioned on a bottom side of the diaphragm;
- an actuation element placed in the cavity of the sense die and in contact with a top side of the diaphragm and with a wall of the cavity;
- and
- a cover member positioned on the top side of the sense die, wherein the cover member includes an opening positioned over the cavity of the sense die, wherein a portion of the actuation element extends through the opening,
- wherein the cover member provides wafer-level retention of the actuation element in the cavity.
2 more elements
Dependencies are inferred from the claim text.