Heat sink for light emitting diode
AssigneeKobe Steel, Ltd.
InventorsHaruyuki Konishi, Haruyuki Matsuda
Life of this patent
Estimating the term…
Loading patent…
AssigneeKobe Steel, Ltd.
InventorsHaruyuki Konishi, Haruyuki Matsuda
Estimating the term…
A heat sink includes a base, to which an LED element is attached, and a plate-shaped heat dissipating surface integrally and continuously formed with the base around the LED element. The base and the plate-shaped heat dissipating surface are formed of aluminum or an aluminum alloy having a specific thermal conductivity λ and a specific surface emissivity ε. When the plate thickness of the base and the plate-shaped heat dissipating surface is specified in a range from 0.8 to 6 mm, a total projected area of the heat dissipating surfaces of the heat sink is specified in a range from 19000 to 60000 mm2 so as to obtain a heat resistance of 4.0 K/W or smaller. Projected areas of two plate-shaped heat dissipating surfaces of the heat sink in two different directions are sufficiently increased with respect to corresponding sectional areas of the base.
A heat sink for light emitting diode lighting, the heat sink comprising:
A heat sink for light emitting diode lighting, the heat sink comprising:
Dependencies are inferred from the claim text.