Electroless copper plating compositions
AssigneesRohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
InventorsDavid S. Laitar, Crystal P. L. Li, Andy Lok-Fung Chow
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Abstract
Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
Claims4
An electroless copper plating composition comprising one or more sources of copper ions, one or more chelating agents chosen from Rochelle salts or dipotassium tartrate, and one or more reducing agents selected from the group consisting of 2,2-dimethoxyacetaldehyde, 2,2-diethoxyacetaldehyde, 2,2dipropoxyacetaldehyde and 2,2-dibutoxyacetaldehyde in amounts of 1 g/L to 50 g/L[, wherein the composition is free of amines].
Dependencies are inferred from the claim text.