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US 9,869,022 B2Granted
Substrate processing apparatus
AssigneeHitachi Kokusai Electric Inc.
InventorMotoshi Sawada
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus includes a shower head configured to disperse a gas; a process vessel installed at a downstream side of the shower head and configured to have a process space that allows a substrate to be processed by a process gas therein; a gas supplier connected to the shower head; a shower head gas exhauster connected to the shower head; and a capturing assembly configured to capture a component different from the process gas within the shower head.
Claims7
A substrate processing apparatus, comprising:
- a shower head configured to disperse a gas;
- a process vessel installed at a downstream side of the shower head and configured to have a process space in which a substrate is processed by a process gas;
- a gas supplier connected to the shower head;
- a capturing assembly, including either a combination of a cryotrap and a vacuum pump or a cryopump;
- a shower head gas exhauster, wherein the shower head gas exhauster includes:
- a first exhaust pipe with a first valve for exhausting the shower head, the first exhaust pipe being connected to the shower head;
- and
- a second exhaust pipe, one end of the second exhaust pipe being connected to a portion of the first exhaust pipe between the shower head and the first valve, wherein, in the second exhaust pipe, a second valve for exhausting the shower head and the capturing assembly are installed in this order from an upstream side of the shower head;
- and
- a controller configured to:
- in a film forming process being performed with respect to the substrate in the process space, control the substrate processing apparatus to process the substrate by supplying the process gas from the gas supplier to the processing space;
- and
- in a cleaning solution removal process after a wet-cleaning of the shower head, the cleaning solution removal process being performed with respect to no substrate in the process space, control the vacuum pump or the cryopump to capture a component different from the process gas, among residual components of the cleaning solution in the wet-cleaning, by closing the first valve and opening the second valve.
10 more elements
Dependencies are inferred from the claim text.