Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element

A method for manufacturing a semiconductor device comprising:

• a step of forming an adhesive layer of an adhesive composition on a semiconductor substrate, the adhesive composition comprising:
• (a) an acrylic polymer having a weight-average molecular weight of 100000 or more,
• (b) a compound having at least two (meth)acrylol groups, and
• (c) a polymerization initiator, wherein
• a structural unit having a nitrogen atom-containing group in the (a) acrylic polymer having a weight-average molecular weight of 100000 or more accounts for 5 mass % or less based on a total amount of the (a) acrylic polymer having a weight-average molecular weight of 100000 or more, and
• the (a) acrylic polymer having a weight-average molecular weight of 100000 or more has a structural unit having a functional group,
• a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and
• a step of curing the adhesive layer.