US 9,868,751 B2Granted

Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same

AssigneeSamsung SDI Co., Ltd.

InventorsMin Gyum Kim, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi

Life of this patent

Estimating the term…

Abstract

A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:

Claims21

Dependent claims

A phosphonium compound represented by one of the following Formulae 1a to 1o:

Dependencies are inferred from the claim text.

Facts

Application: 14/918,916Filed 21 Oct 2015
Priority: KR 10-2014-014363822 Oct 2014
Published: US 2016/0115184 A128 Apr 2016
Granted: 16 Jan 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification34 codes

C07F 9/5442
Quaternary phosphonium compounds: aromatic phosphonium compounds
C07C 39/08
Monocyclic with no unsaturation outside the aromatic ring: dihydroxy benzenes; Alkylated derivatives thereof
C07C 39/12
Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring: polycyclic with no unsaturation…
C07C 39/17
Polycyclic with no unsaturation outside the aromatic rings: containing other rings in addition to the six-membered aromatic rings , e.g.…

Family

US 2016/0115184 A1Pre-grant publication · published 28 Apr 2016
US 9,868,751 B2This patent

From the US filing history. Foreign family members aren’t listed.

Timeline

Citations

Open elsewhere

patentgrep

Loading patent…

patentgrepSearch patents

Back to results