Molded cavity package with embedded conductive layer and enhanced sealing

A method of forming a semiconductor package, comprising:

• providing a base plate with a first side that comprises an elevated portion, a recessed portion laterally surrounding the elevated portion, and a vertical face extending from the recessed portion to the elevated portion;
• covering at least a part of the vertical face with a metal layer;
• forming a mold compound structure on the first side with the metal layer disposed between the first side and the mold compound structure such that the mold compound structure comprises an elevated portion laterally surrounding a recessed portion, and opposing edge faces that vertically extend from the recessed portion of the mold compound structure to the elevated portion of the mold compound structure;
• and
• subsequently removing at least a part of the base plate such that the recessed portion of the mold compound structure is uncovered from the base plate and such that the metal layer remains on at least one uncovered section of the mold compound structure.