Semiconductor device

A semiconductor device comprising:

• a semiconductor element;
• a case in which the semiconductor element is disposed;
• a terminal that is made of a conductive material and is embedded in the case, a part of the terminal being exposed to an outside, having an outermost surface that includes a first film that contains at least one of Au, Ag and Pd as a main component, and further having, as a base of the first film, a base portion made of a conductive material different from material of the first film;
• a bonding wire that is connected to the first film and electrically connects the semiconductor element and the terminal;
• and
• a protection member that is more flexible than the case and covers a contact portion of the terminal contacting with the bonding wire, wherein
• the first film is removed from an area around the contact portion with the bonding wire in the part of the terminal being exposed to the outside, causing the base portion to be exposed, and
• an exposed portion of the base portion and the protection member bond to each other.