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US 9,867,552 B2Granted
Implantable sensor enclosure with thin sidewalls
AssigneeEndotronix, Inc.
InventorsHarry D. Rowland, Michael Nagy
Life of this patent
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Abstract
A wireless circuit includes a housing, such as a hermetic housing, and at least one antenna coil wound about a coil axis within the housing. The coil axis may be substantially parallel to at least one wall of the housing, wherein the wall parallel to the coil axis is substantially thinner than other walls of the housing.
Claims14
A wireless circuit for an implant comprising:
- a housing including side walls defining a cuboid wherein said housing has a length, width and height dimensions, and wherein the length is greater than the housing's width and height dimensions, and wherein two opposite sides of the housing are open;
- at least one antenna coil wound about a coil axis and positioned within said housing;
- thin walls bonded to the open sides of the housing wherein said coil axis is substantially parallel to the thin walls of said housing and perpendicular to said length of said housing;
- wherein said thin walls are thinner than the side walls of said housing.
1 more element
Dependencies are inferred from the claim text.