Apparatus for mounting electronic component
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHideaki Watanabe, Shigeki Imafuku, Toshiyuki Koyama
Life of this patent
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Abstract
Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.
Claims7
An apparatus for mounting an electronic component having a plurality of board insert type leads on a board, the apparatus comprising:
- a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads;
- a base body having a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to change relative positions of chucking respective leads by the first chuck unit and the second chuck unit;
- and
- a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board,
- wherein the first chuck unit and the second chuck unit extend separately from the base body with no portion of the first chuck unit being attached to the second chuck unit.
Dependencies are inferred from the claim text.