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US 9,867,317 B1Granted
Heat sink with mounted power supply
AssigneeJuniper Networks, Inc.
InventorThomas W. Jetton
Life of this patent
Estimating the term…
Abstract
An apparatus may include a heat sink to be mounted to a printed circuit board. The apparatus may include a power supply mounted to the heat sink. The power supply may receive input power and supply output power to one or more components of the printed circuit board.
Claims20
An apparatus, comprising:
- a heat sink directly mounted to a printed circuit board or a component of the printed circuit board using a conductive fastener;
- and
- a power supply, mounted to the heat sink, to:
- receive input power via the conductive fastener, and
- supply output power to one or more components of the printed circuit board.
2 more elements
A heat sink comprising:
- a fin area that includes one or more fins to dissipate heat;
- and
- a fin-free area,
- a power supply being mounted to the fin-free area, the heat sink being directly mounted to a printed circuit board or a component of the printed circuit board using a plurality of conductive fasteners,
- the power supply to receive input power via a first conductive fastener of the plurality of conductive fasteners, and
- the power supply to supply output power, to one or more components of the printed circuit board, via a second conductive fastener of the plurality of conductive fasteners.
3 more elements
A device, comprising:
- a heat sink directly mounted to a printed circuit board via each of a first conductive fastener and a second conductive fastener;
- and
- a power supply, mounted to the heat sink, to receive input power via the first conductive fastener and supply output power via the second conductive fastener.
Dependencies are inferred from the claim text.