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US 9,867,315 B2Granted
Server memory cooling apparatus
AssigneeAsetek Danmark A/S
InventorsTodd Berk, Andre S. Eriksen
Life of this patent
Estimating the term…
Abstract
A system to aid in cooling an in-line memory module may include a heat spreader including a channel to accommodate the in-line memory module, thermal interface material, and a liquid-cooler block including a heat-conducting cold plate and an internal liquid channel filled with circulating cooling liquid. Also disclosed are systems employing tubes to convey cooling fluid.
Claims11
A thermal management system comprising:
- a heat spreader configured to attach to an in-line memory module;
- a liquid-cooler block comprising:
- a heat-conducting cold plate with an exterior surface;
- a plurality of internal liquid channels defining a flow path in thermal communication with the cold plate, wherein the plurality of internal liquid channels are configured to receive a liquid in the flow path;
- an inlet formed in the liquid-cooler block and located at a first end of the flow path;
- and
- an outlet formed in the liquid-cooler block and located at a second end of the flow path;
- wherein the liquid-cooler block is configured so that the liquid enters the liquid-cooler block through the inlet and distributes through the plurality of internal liquid channels, and then collects and exits the liquid-cooler block through the outlet;
- and
- at least one securing mechanism configured to extend through the liquid-cooler block and the cold plate and engage the heat spreader in order to maintain thermal communication between the heat spreader and the exterior surface of the cold plate;
- whereby the thermal management system is configured to transfer heat generated by the in-line memory module from the heat spreader to the cold plate, for removal by the liquid circulating in the plurality of internal liquid channels.
8 more elements
A thermal management system comprising:
- a liquid-cooler block having:
- a heat-conducting cold plate with an exterior surface;
- and
- a plurality of internal liquid channels having a flow path in thermal communication with the cold plate, wherein the plurality of internal liquid channels are configured to receive a liquid in the flow path;
- a plurality of breaking features located in the flow path configured to create turbulence in the liquid along the flow path;
- and
- a heat spreader having a channel for accommodating an in-line memory module within the channel, wherein the heat spreader has a first width at a region configured to attach to the in-line memory module and a second width, greater than the first width, at a region configured to thermally contact the cold plate, wherein a difference between the first width and the second width forms a structural feature for engaging a securing mechanism, wherein the securing mechanism is configured to extend through the liquid-cooler block and the cold plate, and engage the structural feature and to maintain thermal communication between the heat spreader and the exterior surface of the cold plate.
4 more elements
Dependencies are inferred from the claim text.