Ball grid array system

An information handling system (IHS), comprising:

• an IHS chassis;
• and
• a circuit board located in the IHS chassis and having a circuit board surface, the circuit board including:
• a plurality of pads that are located on the circuit board surface;
• and
• a ball grid array component that is soldered to the circuit board, the ball grid array component including:
• a plurality of soldered connections between the ball grid array component and the circuit board, wherein each of the plurality of soldered connections has a first melting temperature and has been soldered to a respective one of the plurality of pads during a reflow process;
• and
• a plurality of conductive spacer members that each engage the circuit board and the ball grid array component to complete a ball grid array monitoring circuit that is configured to measure a strength of the plurality of soldered connections, wherein each of the plurality of conductive spacer members has a second melting temperature greater than the first melting temperature such that each of the plurality of conductive spacer members provide a mechanical stop between the ball grid array component and the circuit board during the reflow process that is performed at a temperature below the second melting temperature, and a minimum height for each of the plurality of soldered connections.