Circuit board comprising an insulating diamond material
AssigneesNational ICT Australia Limited, The University of Melbourne
InventorsSamantha Lichter, Nicholas Apollo, David Garrett, Kumaravelu Ganesan, Hamish Meffin, Steven Prawer
Life of this patent
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Abstract
A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.
Claims20
A diamond circuit board comprising:
- an electrically insulating diamond material having a surface;
- at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material such that only the electrically insulating diamond material defines the recess;
- and
- an electrically conductive material located at least partially within the recess on the electrically insulating diamond material that defines the recess.
An implantable medical device comprising:
- a diamond circuit board comprising:
- an electrically insulating diamond material having a surface;
- at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material such that only the electrically insulating diamond material defies the recess such that only the electrically insulating diamond material defines the recess;
- an electrically conductive material located at least partially within the recess on the electrically insulating diamond material that defines the recess;
- a housing;
- an electronic component, wherein the circuit board forms a portion of the housing and the electronic component is positioned within an interior portion of the implantable medical device and is coupled to the circuit board.
A method of forming a diamond circuit board, the method comprising:
- providing a substrate that comprises an electrically insulating diamond material;
- and
- forming an electrically conductive material, the electrically conductive material being formed so as to be located at least partially within a recess of the electrically insulating diamond material, the recess being defined only by the electrically insulating diamond material;
- wherein the recess extends into only a portion of a thickness of the electrically insulating diamond material from a surface of the electrically insulating diamond material and the electrically conductive material is located on the electrically insulating diamond material that defines the recess.
Dependencies are inferred from the claim text.