Printed circuit board components

An apparatus, comprising:

• a first surface mount technology component with at least one component contact coupled to at least one printed circuit board contact, wherein the first surface mount technology component has a top surface;
• first and second metal members coupled to first and second additional printed circuit board contacts, wherein the first surface mount technology component is interposed between the first and second metal members;
• a second surface mount technology component that is coupled to the first and second metal members and that overlaps the first surface mount technology component, wherein the second surface mount technology component has a bottom surface and wherein the top surface of the first surface mount technology component and the bottom surface of the second surface mount technology component are separated by a gap;
• and
• an insulating layer in the gap between the top surface of the first surface mount technology component and the bottom surface of the second surface mount technology component.

A surface mount technology component comprising:

• a dielectric body with first and second opposing surfaces;
• an electrical component mounted within the dielectric body;
• first and second electrical component pads on the first surface that are coupled respectively to first and second printed circuit board contacts;
• and
• first and second standoff portions that are electrically isolated from the first and second electrical component pads and that each have a lower pad on the first surface of the dielectric body that is shorted to an opposing upper pad on the second surface of the dielectric body, wherein the first and second standoff portions are integrally formed with the dielectric body.