Warpage control with intermediate material

A method of manufacturing a mounting device for mounting electronic components, wherein the method comprises:

• providing an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction;
• arranging an electrically insulating structure on the electrically conductive structure, the electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value;
• forming a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction;
• selecting the third value and locating the thermal expansion adjustment structure so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure;
• wherein the third value is selected to be smaller than both the first value and the second value.