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US 9,867,283 B2Granted
Package board and prepreg
AssigneeSamsung Electronics Co., Ltd.
InventorsJin-gyu Kim, Hyun Lee, Dong-han Kim
Life of this patent
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Abstract
A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.
Claims12
A package board, comprising:
- a circuit layer having a circuit pattern;
- and
- a fiber layer including at least one first fiber that extends in a first direction and is a non-woven fiber,
- wherein the fiber layer is stacked on a top surface of the circuit layer,
- wherein the at least one first fiber of the fiber layer, non-overlapped with the circuit pattern of the circuit layer, is interposed between the top surface of the circuit layer and a top surface of the fiber layer,
- wherein the fiber layer comprises a first region, which overlaps a region where the circuit pattern is formed within the circuit layer, and a second region, which overlaps a region where the circuit pattern is not formed within the circuit layer,
- wherein the at least one first fiber is formed in the second region,
- wherein the first direction is substantially a same direction in which a first side of the package board extends, and
- wherein the second region of the fiber layer comprises edge portions that are adjacent to the first side and a second side that is parallel to the first side.
6 more elements
Dependencies are inferred from the claim text.