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US 9,867,282 B2Granted
Circuit board with corner hollows
AssigneesATI Technologies ULC, Advanced Micro Devices, Inc.
InventorsSuming Hu, Neil McLellan, Andrew K W Leung, Jianguo Li
Life of this patent
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Abstract
A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes.
Claims20
An apparatus, comprising:
- a circuit board having a first side configured to have a semiconductor chip mounted thereon and four corner hollows, the circuit board having a perimeter partially defined by the four corner hollows;
- and
- wherein the circuit board includes an interconnect layer having plural conductor traces to conduct current and that track the perimeter.
An apparatus, comprising:
- a semiconductor chip package substrate having a first side, a second side opposite to the first side, four corner hollows and outer edges defined in part by the four corner hollows;
- plural interconnect structures coupled to the second side to electrically interface with another device, those of the interconnect structures positioned closer to the edges than the other interconnect structures being operable to convey power and ground and the other interconnect structures being operable to convey signals;
- and
- a semiconductor chip mounted on the first side.
1 more element
An apparatus, comprising:
- a semiconductor chip package substrate having a first side and four corner hollows and a first footprint defined in part by the four corner hollows;
- a semiconductor chip mounted on the first side;
- and
- a stiffener frame mounted on the first side, the stiffener frame having a second footprint that tracks the first footprint.
1 more element
Dependencies are inferred from the claim text.