Assembly comprising a hyperfrequency component and a printed circuit
AssigneeRadiall
InventorsAlexandre Flaceau, Emilie Fond
Life of this patent
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Abstract
The inventive assembly comprises a hyperfrequency component of the surface-mounted component type including at least one first hyperfrequency transmission line, as well as a printed circuit board including at least one second hyperfrequency transmission line able to be put in contact with the first hyperfrequency transmission line. The component comprises an enclosure with a face in contact with the printed circuit board, which includes at least one cavity for confining a hyperfrequency signal, delimited by conductive surfaces of the enclosure, and by a conductive zone of the second hyperfrequency transmission line.
Claims14
An assembly comprising:
- a surface-mounted hyperfrequency component including at least two first hyperfrequency transmission lines;
- a printed circuit board including at least two second hyperfrequency transmission lines, each second hyperfrequency transmission line being connected to a corresponding first hyperfrequency transmission line,
- the surface-mounted hyperfrequency component comprising an enclosure having a face in contact with the printed circuit board;
- and
- for each first hyperfrequency transmission line, one cavity configured to confine a hyperfrequency signal, each cavity being delimited by:
- at least one conductive surface of the enclosure, and
- a grounded conductive zone on a surface of the printed circuit board, at least partially closing a recess of the enclosure delimited by the conductive surface to form the cavity, the grounded conductive zone being at least a portion of a bottom surface of the cavity when the hyperfrequency component and the printed circuit board are aligned along a vertical direction, the hyperfrequency component being above the printed circuit board.
Dependencies are inferred from the claim text.