High performance vertical interconnection
AssigneeInfineon Technologies Austria AG
InventorsMartin Standing, Andrew Roberts
Life of this patent
Estimating the term…
Abstract
Representative implementations of devices and techniques provide improved electrical performance of components, such as chip dice, for example, disposed on different layers of a multi-layer printed circuit board (PCB). In an example, the components may be embedded within layers of the PCB. An insulating layer located between two component layers or sets of layers includes a conductive portion that may be strategically located to provide electrical connectivity between the components. The conductive portion may also be arranged to improve thermal conductivity between points of the PCB.
Claims16
A system, comprising:
- a multi-layer printed circuit board (PCB) including at least a first layer, a second layer, and an insulating third layer disposed between the first layer and the second layer;
- a first node of a first circuit component electrically coupled to the first layer;
- a second node of a second circuit component electrically coupled to the second layer;
- and
- one or more conductive vias extending along a vertical direction through the first, second, and third layers and electrically coupling the first node to the second node in a first circuit path, the insulating third layer including a conductive portion arranged to electrically couple the first node to the second node in a second circuit path, wherein the conductive portion comprises a conductive material, wherein the one or more conductive vias extend through the conductive material, and wherein the conductive material has a width along a horizontal direction that is greater than a width of the one or more conductive vias along the horizontal direction.
A system, comprising:
- a multi-layer printed circuit board (PCB) including at least a first set of layers, a second set of layers, and a dielectric layer disposed between the first set of layers and the second set of layers;
- a first circuit component embedded within the first set of layers;
- a second circuit component embedded within the second set of layers;
- one or more conductive vias extending along a vertical direction through the first set of layers, the second set of layers, and the dielectric layer and electrically coupling a first node of the first circuit component to a second node of the second circuit component by way of one or more layers of the first set of layers and the second set of layers, the dielectric layer including a conductive portion arranged to electrically couple the first node to the second node in a second parallel circuit path, wherein the conductive portion comprises a conductive material, wherein the one or more conductive vias extend through the conductive material, and wherein the conductive material has a width along a horizontal direction that is greater than a width of the one or more conductive vias along the horizontal direction.
Dependencies are inferred from the claim text.