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US 9,867,273 B2Granted
Printed circuit, thin film transistor and manufacturing method thereof
AssigneeWinbond Electronics Corp.
InventorYu-Hsuan Ho
Life of this patent
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Abstract
A printed circuit, a thin film transistor and manufacturing methods thereof are provided. The printed circuit includes a plurality of metal nanostructures and a metal oxide layer. The metal oxide layer is disposed on a surface of the metal nanostructures and fills a space at an intersection of the metal nanostructures. The metal oxide layer disposed on the surface of the metal nanostructures has a thickness of 0.1 nm to 10 nm.
Claims6
A manufacturing method of a thin film transistor, comprising:
- performing a first printing process to form a patterned conductive layer on a substrate, wherein the patterned conductive layer comprises a plurality of metal nanostructures;
- performing a second printing process to form a metal oxide precursor layer on the patterned conductive layer, the metal oxide precursor layer covering the patterned conductive layer, wherein the metal oxide precursor layer comprises a metal oxide precursor and a solvent;
- and
- performing a heating process to remove the solvent in the metal oxide precursor layer and transforming the metal oxide precursor in the metal oxide precursor layer to a metal oxide, so as to form a metal oxide layer on a surface of the metal nanostructures, the metal oxide layer aggregates in a space at an intersection of the metal nanostructures;
- forming an active layer on the substrate to cover the patterned conductive layer and the metal oxide layer and fill a space between the patterned conductive layer;
- forming a dielectric layer on the substrate to cover the active layer;
- and
- forming a gate on the dielectric layer,
- wherein the metal oxide layer formed on the surface of the metal nanostructures has a thickness of 0.1 nm to 10 nm.
6 more elements
Dependencies are inferred from the claim text.