Manufacturing method of semiconductor apparatus, semiconductor apparatus, and endoscope

A semiconductor apparatus, comprising:

• a semiconductor device chip having a semiconductor device unit on an obverse surface and junction terminals on a reverse surface, the junction terminals being connected with the semiconductor device unit via through wirings;
• a signal cable having core wires electrically connected with the semiconductor device unit;
• a wiring board having a rectangular shape and a width smaller than a width of the semiconductor device chip, the wiring board having first terminals joined to the junction terminals and second terminals on a first primary surface, the first terminals disposed on a first end of the first primary surface and the second terminals and second terminals being disposed on a second end of the first primary surface with a flexible portion intervened in between, the second terminals being joined to the core wires of the signal cable by soldering, the wiring board being bent at the flexible portion to be in a state where the first primary surface and the second primary surface are parallel;
• a heat conductive block sandwiched by the second primary surface of the wiring board that is bent, and made of a material having thermal conductivity not lower than 20 Wm−1K−1;
• and
• a frame member in which the semiconductor device chip, the wiring board, the heat conductive block and the signal cable are housed, the frame member being made of metal and an inside of the frame member being sealed with sealing resin.

An endoscope comprising an image pickup apparatus at a distal end portion of an insertion portion, the image pickup apparatus comprising:

• an image pickup device chip having an image pickup unit on an obverse surface and junction terminals on a reverse surface, the junction terminals being connected with the image pickup unit via through wirings;
• a signal cable having core wires electrically connected with the image pickup unit;
• a wiring board having a rectangular shape and a width smaller than a width of the image pickup device chip, the wiring board having first terminals joined to the junction terminals and second terminals on a first primary surface, the first terminals disposed on a first end of the first primary surface and second terminals being disposed on a second end of the first primary surface with a flexible portion intervened in between, the second terminals being joined to the core wires of the signal cable by soldering, the wiring board being bent at the flexible portion to be in a state where the first primary surface and the second primary surface are parallel;
• a heat conductive block sandwiched by the second primary surface of the wiring board that is bent, and made of a material having thermal conductivity not lower than 20 Wm−1K−1;
• and
• a frame member in which the image pickup device chip, the wiring board, the heat conductive block and the signal cable are housed, the frame member being made of metal and an inside of the frame member being sealed with sealing resin.