US 9,866,735 B2 · Camera module

Abstract

A camera module of the present invention, provided by adhering a glass substrate to the cover body so that the glass substrate covers an opening of a sensor cover for covering an image pickup element mounted on a wiring substrate, which opening is provided above the image pickup element, the camera module includes: an image pickup package having an internal space provided by the glass substrate, the sensor cover, and the glass substrate; and an image pickup lens provided above the glass substrate of the image pickup package, wherein at least one ventilation groove (G) for allowing the internal space to communicate with open air is provided on an adhesive surface of the glass substrate of the sensor cover.

Drawings

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Drawings

Claims8

Dependent claims

A camera module comprising:

an image pickup package including:
a substrate,
an image pickup element on the substrate,
a cover body for covering the image pickup element on the substrate,
a transparent plate being attached to the cover body in such a manner that the transparent plate covers an opening of the cover body which opening is above the image pickup element, so that the substrate, the cover body, and the transparent plate define an internal space;
and
an image pickup lens provided above the transparent plate of the image pickup package,
a plurality of grooves being provided so as to be in a plane of the cover body on which plane the transparent plate is attached, the plurality of grooves being on a surface of the cover body which surface faces the transparent plate, and
at least one of the plurality of grooves configured to allow the internal space to communicate with open air, and
at least one of the plurality of grooves comprising a recess section configured to trap foreign matter which has intruded into an inside of said at least one of the plurality of grooves, the recess section being positioned lower than a bottom surface of said at least one of the plurality of grooves.

7 more elements

Dependencies are inferred from the claim text.

Description10,816 words

Summary1,537 words

#This application is the U.S. national phase of International Application No. PCT/JP2013/052551, filed 5 Feb. 2013, which designated the U.S. and claims priority to JP Application No. 2012-033039, filed 17 Feb. 2012, and JP Application No. 2013-2897, filed 10 Jan. 2013, the entire contents of each of which are hereby incorporated by reference.

#The present invention relates to a camera module for capturing an image in a camera-equipped mobile phone, a digital camera, a security camera, or the like, and, specifically, relates to ventilation of an internal space of an image pickup package including an image pickup element, a wiring substrate, a lens, and a glass substrate.

#A camera module for use in a camera-equipped mobile phone, a digital camera, a security camera, or the like is structured such that a solid state image pickup element such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor), a wiring substrate including a glass substrate and a terminal, a sensor cover retaining the solid state image pickup element and the wiring substrate, a lens, and a lens holder are integrated.

Brief description of the drawings5 figures

#FIG. 1 is a cross-sectional view illustrating a configuration of a camera module in Embodiment 1 of the present invention.

#(a) of FIG. 2 is a plan view illustrating a configuration of an image pickup package of the camera module other than a glass substrate. (b) of FIG. 2 is a cross-sectional view taken along the arrows X-X of (a).

#(a) of FIG. 3 is a plan view illustrating a configuration of an image pickup package of the camera module. (b) of FIG. 3 is a cross-sectional view taken along the arrows X-X of (a).

Detailed description8,788 words

#The following description will discuss an embodiment of the present invention with reference to FIGS. 1 to 9.

#(Basic Configuration of Camera Module)

#The following description will discuss a configuration of a camera module according to Embodiment 1 with reference to FIG. 1. FIG. 1 is a cross-sectional view illustrating the configuration of the camera module according to Embodiment 1.

Facts

Application

14/377,424Filed 5 Feb 2013

Priority

JP 2012-03303917 Feb 2012

Published

US 2015/0172519 A118 Jun 2015

Granted

9 Jan 2018

Term ends

12 Jun 2033

Estimated · how

20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment, including 127 days of adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.

Classification8 codes

H04N 23/51
Constructional details: housings
H04N 23/55
Constructional details: optical parts specially adapted for electronic image sensors; Mounting thereof
H04N 23/57
Cameras or camera modules comprising electronic image sensors; Control thereof: mechanical or electrical details of cameras or camera modules…
H10F 39/804
Constructional details of image sensors: containers or encapsulations

Timeline

17 Feb 2012Priority claimedJP 2012-033039
5 Feb 2013Application filedUS 14/377,424
7 Aug 2014Assigned to Sharp Kabushiki Kaishaassignment of assignor's interest
18 Jun 2015PublishedUS 2015/0172519 A1
9 Jan 2018GrantedUS 9,866,735 B2
12 Oct 2026TodayWithin its term
12 Jun 2033Term endsEstimated, includes 127 days of adjustment

Camera module

Life of this patent

Camera module

Life of this patent

Life of this patent

Abstract

Drawings

Drawings

Claims8

Description10,816 words

Classification8 codes

Life of this patent

Drawings

Description10,816 words