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US 9,866,265 B2Granted
High frequency circuit module in which high frequency circuits are embedded in a multilayer circuit substrate
AssigneeTaiyo Yuden Co., Ltd.
InventorsTetsuo Saji, Hiroshi Nakamura
Life of this patent
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Abstract
A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.
Claims12
A high frequency circuit module, comprising:
- a multilayer circuit substrate formed by alternately stacked insulating layers and conductive layers;
- a transmission filter that performs filtering on high frequency transmission signals;
- a reception filter that performs filtering on high frequency reception signals;
- and
- a first high frequency switch that switches connections of an antenna and the transmission and reception filters,
- wherein either one or both of the transmission filter and reception filter, and the first high frequency switch, are embedded within and inside of the multilayer circuit substrate under an uppermost insulating layer of the multilayer circuit substrate,
- wherein a first ground conductor is formed in a first conductive layer located above the first high frequency switch and each embedded filter in the multilayer circuit substrate, the first ground conductor being formed in regions facing at least the first high frequency switch and each embedded filter,
- wherein a second ground conductor is formed in a second conductive layer located below the first high frequency switch and each embedded filter in the multilayer circuit substrate, the second ground conductor being formed in regions facing at least the first high frequency switch and each embedded filter,
- wherein a first matching circuit between the antenna and first high frequency switch is mounted on a top surface of the multilayer circuit substrate, and terminal electrodes of the high frequency circuit module are formed on a bottom surface that is opposite to the top surface, and
- wherein input/output terminals of the first high frequency switch are formed on the top surface of the multilayer circuit substrate.
7 more elements
A high frequency circuit module comprising:
- a multilayer circuit substrate formed by alternately stacked insulating layers and conductive layers;
- a transmission filter that performs filtering on high frequency transmission signals;
- a reception filter that performs filtering on high frequency reception signals;
- a first high frequency switch that switches connections of an antenna and the transmission and reception filters,
- wherein either one or both of the transmission filter and reception filter, and the first high frequency switch, are embedded within and inside of the multilayer circuit substrate under an uppermost insulating layer of the multilayer circuit substrate,
- wherein a first ground conductor is formed in a first conductive layer located above the first high frequency switch and each embedded filter in the multilayer circuit substrate, the first ground conductor being formed in regions facing at least the first high frequency switch and each embedded filter, and
- wherein a second ground conductor is formed in a second conductive layer located below the first high frequency switch and each embedded filter in the multilayer circuit substrate, the second ground conductor being formed in regions facing at least the first high frequency switch and each embedded filter,
- wherein the high frequency circuit module further comprises:
- a plurality of the transmission filters having mutually different frequency bands that are embedded in at least the multilayer circuit substrate;
- an amplifier that amplifies the transmission signals;
- and
- a third high frequency switch that switches the transmission filters connecting to output terminals from the amplifier,
- wherein the third high frequency switch is embedded in the multilayer circuit substrate, and
- wherein signal wires that connect the third high frequency switch and the transmission filters are provided in the multilayer circuit substrate.
11 more elements
Dependencies are inferred from the claim text.