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US 9,865,953 B2Granted
Electrical contact assembly for printed circuit boards
AssigneeInternational Business Machines Corporation
InventorsNa Fan, Jun Hu, Sen Xiong Huang, YongDong Shi, XiYuan Yin
Life of this patent
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Abstract
A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.
Claims7
An assembly process comprising:
- inserting a socket pin into a socket housing, the socket pin having a contact region, the socket housing having a rectangular contact cavity that receive the contact region, the contact region passing through the rectangular contact cavity and extending beyond the socket housing;
- bending the socket pin such that the contact region is configured to receive a solder ball including:
- securing the socket housing,
- striking the contact region in a first direction, and
- striking the contact region in a second direction such that the contact region is bent more than 90 degrees from an original orientation;
- and
- attaching the solder ball to the contact region;
- wherein:
- the contact region is bounded by an end of the socket pin and a stress concentration feature, and
- the socket pin bends at the stress concentration feature.
7 more elements
Dependencies are inferred from the claim text.