Printed circuit board for antenna system

A method of manufacturing a PCB, the method comprising:

• forming a Substrate Integrated Waveguide (SIW) structure having a first conductive boundary disposed within a first conductive layer of the PCB, a second conductive boundary disposed within a second conductive layer of the PCB, and a plurality of first vias coupling the first conductive boundary to the second conductive boundary;
• forming at least one aperture in the second conductive boundary of the SIW structure and aligned with the at least one waveguide antenna;
• forming at least one waveguide antenna disposed at least partially within further conductive layers of the PCB, the further conductive layers including a third conductive layer and a fourth conductive layer, wherein the second conductive layer is disposed between the first conductive layer and the third conductive layer, and wherein the third conductive layer is disposed between the second conductive layer and the fourth conductive layer;
• forming a conductive trace of a transmission line, the conductive trace disposed within the third conductive layer, at least a portion of the conductive trace aligned overtop of the second conductive boundary of the SIW structure thereby facilitating operation of the transmission line, the conductive trace routed around the at least one aperture;
• and
• forming at least one further antenna disposed at least partially within the fourth conductive layer and operatively coupled to the transmission structure through a further via.

A wireless communication device comprising a Printed Circuit Board (PCB), the PCB comprising:

• a Substrate Integrated Waveguide (SIW) structure having a first conductive boundary disposed within a first conductive layer of the PCB, a second conductive boundary disposed within a second conductive layer of the PCB, and a plurality of first vias coupling the first conductive boundary to the second conductive boundary;
• at least one waveguide antenna disposed at least partially within further conductive layers of the PCB, the further conductive layers including a third conductive layer and a fourth conductive layer, wherein the second conductive layer is disposed between the first conductive layer and the third conductive layer, and wherein the third conductive layer is disposed between the second conductive layer and the fourth conductive layer;
• at least one aperture formed in the second conductive boundary of the SIW structure and aligned with the at least one waveguide antenna;
• a conductive trace of a transmission line, the conductive trace disposed within the third conductive layer, at least a portion of the conductive trace aligned overtop of the second conductive boundary of the SIW structure, the conductive trace routed around of the at least one aperture;
• and
• at least one further antenna disposed at least partially within the fourth conductive layer and operatively coupled to the conductive trace.