US 9,865,837 B2Granted

Light-emitting device, electronic device, and lighting device

AssigneeSemiconductor Energy Laboratory Co., Ltd.

InventorsShunpei Yamazaki, Yasuhiro Jinbo, Shingo Eguchi

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Abstract

A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.

Claims31

Dependent claims

A light-emitting device comprising:

a first flexible substrate;
a first bonding layer over the first flexible substrate;
a first insulating layer over the first bonding layer;
a transistor over the first insulating layer;
a second insulating layer over the transistor;
a light-emitting element over the second insulating layer, the light-emitting element being electrically connected to the transistor, wherein the light-emitting element comprises:
a first electrode over the second insulating layer;
a third insulating layer over the first electrode;
a fourth insulating layer over the third insulating layer;
a light-emitting layer over the third insulating layer and the fourth insulating layer;
and
a second electrode over the light-emitting layer;
a first conductive layer over the first insulating layer;
a first connector over the first conductive layer;
a first FPC electrically connected to the first conductive layer through the first connector;
a second flexible substrate over the light-emitting element;
a touch sensor over the second flexible substrate, wherein the touch sensor comprises:
a second conductive layer over the second flexible substrate;
a third conductive layer over the second conductive layer;
and
an insulating layer between the second conductive layer and the third conductive layer,
a fourth conductive layer over the second flexible substrate;
a second connector over the fourth conductive layer;
and
a second FPC electrically connected to the fourth conductive layer through the second connector,
wherein each of the third insulating layer and the fourth insulating layer overlaps with the first electrode, and
wherein the second electrode is capable of transmitting visible light.

24 more elements

A light-emitting device comprising:

a first flexible substrate;
a first bonding layer over the first flexible substrate;
a first insulating layer over the first bonding layer;
a transistor over the first insulating layer;
a second insulating layer over the transistor;
a light-emitting element over the second insulating layer, the light-emitting element being electrically connected to the transistor, wherein the light-emitting element comprises:
a first electrode over the second insulating layer;
a third insulating layer over the first electrode;
a fourth insulating layer over the third insulating layer;
a light-emitting layer over the third insulating layer and the fourth insulating layer;
and
a second electrode over the light-emitting layer;
a first conductive layer over the first insulating layer;
a first connector over the first conductive layer;
a first FPC electrically connected to the first conductive layer through the first connector;
a second flexible substrate over the light-emitting element;
a third flexible substrate over the second flexible substrate;
a touch sensor over the third flexible substrate, wherein the touch sensor comprises:
a second conductive layer over the third flexible substrate;
a third conductive layer over the second conductive layer;
and
an insulating layer between the second conductive layer and the third conductive layer,
a fourth conductive layer over the third flexible substrate;
a second connector over the fourth conductive layer;
and
a second FPC electrically connected to the fourth conductive layer through the second connector,
wherein each of the third insulating layer and the fourth insulating layer overlaps with the first electrode, and
wherein the second electrode is capable of transmitting visible light.

25 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/046,753Filed 18 Feb 2016 · continuation
Priority: JP 2013-1600421 Aug 2013
Published: US 2016/0226019 A14 Aug 2016
Granted: 9 Jan 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

H10K 59/40
Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00: oLEDs…
H10K 59/8731
Encapsulations: multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
H10K 77/111
Substrates, e.g. flexible substrates: flexible substrates
H10H 20/854
Encapsulations: characterised by their material, e.g. epoxy or silicone resins

Family

Application14/339,911Parent of this continuation · filed 24 Jul 2014
US 2016/0226019 A1Pre-grant publication · published 4 Aug 2016
US 9,269,914 B2Parent of this continuation
US 2015/0035001 A1Published application
US 9,865,837 B2This patent

From the US filing history. Foreign family members aren’t listed.