Packaging for an electronic device

A method comprising:

• processing a metal substrate;
• performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads of a lead frame and a curved component of the lead frame having two primary leads, each primary lead located at a respective end of the curved component and being substantially flat;
• performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to form recessed portions, at least one of the secondary leads comprising a first recessed portion at a first end of the secondary lead and a first outside portion being substantially flat, the first outside portion comprising corners at a second end of the secondary lead, opposite the first end, configured to contribute to solder wicking, the curved component comprising a second recessed portion;
• attaching a die to the lead frame;
• and
• overmolding the die and a portion of the lead frame to form a housing, wherein at least one surface of a secondary lead forms a bottom surface of the package, wherein at least one surface of the curved component forms the bottom surface of the package, the housing and the second recessed portion of the curved component forming a locking mechanism, the first outside portion of the at least one of the secondary leads extending away from the housing, the two primary leads extending away from the housing.