Current sensors and methods

A method of forming a current comprising:

• providing a leadframe having a plurality of pins;
• coupling a semiconductor die to the leadframe;
• forming a conductor comprising a metal layer on the semiconductor die, the conductor comprising at least one bridge portion and at least two slots, a first slot having a first tip and a second slot having a second tip, a distance between the first and second tips defining a width of one of the at least one bridge portion, wherein the conductor is separated from the leadframe by at least a thickness of the semiconductor die, and the thickness is about 0.2 millimeters (mm) to about 0.7 mm;
• coupling the conductor to at least two of the plurality of pins;
• arranging at least two magnetic sensor elements in the die relative to and spaced apart from the at least one bridge portion and more proximate the conductor than the leadframe;
• and
• enclosing the leadframe, the semiconductor die, the conductor and the at least two magnetic field sensor elements in a package such that at least a portion of the plurality of pins are exposed from the package.