Resonant transducer, manufacturing method therefor, and multi-layer structure for resonant transducer

A resonant transducer comprising:

• a silicon single crystal substrate;
• a silicon single crystal resonator disposed over the silicon single crystal substrate;
• a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate;
• an exciting module configured to excite the resonator;
• a vibration detecting module configured to detect vibration of the resonator;
• a first layer disposed over the chamber, the first layer having a through-hole over the resonator;
• a second layer disposed over the first layer, the second layer covering a gap being positioned above the through-hole and being communicated with the through-hole;
• a third layer covering the first layer and the second layer, and the third layer sealing the gap;
• and
• a non-empty spacer forming the gap, the non-empty spacer being integral with the second layer.

A resonant transducer comprising:

• a silicon single crystal substrate;
• a silicon single crystal resonator disposed over the silicon single crystal substrate;
• a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate;
• an exciting module configured to excite the resonator;
• a vibration detecting module configured to detect vibration of the resonator;
• a first layer disposed over the chamber, the first layer having a through-hole over the resonator;
• a second layer disposed over the first layer, the second layer covering a gap being positioned above the through-hole and being communicated with the through-hole;
• and
• a third layer covering the first layer and the second layer, and the third layer sealing the gap,
• wherein the gap has a concave space over the through-hole and between the first layer and the second layer.

A multi-layer structure for a resonant transducer, the multi-layer structure comprising:

• a first layer having a through-hole;
• a second layer disposed over the first layer, the second layer covering a gap being positioned above the through-hole and being communicated with the through-hole;
• a third layer covering the first layer and the second layer, and the third layer sealing the gap;
• and
• a non-empty spacer forming the gap, the non-empty spacer being integral with the second layer.

A multi-layer structure for a resonant transducer, the multi-layer structure comprising:

• a first layer having a through-hole;
• a second layer disposed over the first layer, the second layer covering a gap being positioned above the through-hole and being communicated with the through-hole;
• and
• a third layer covering the first layer and the second layer, and the third layer sealing the gap,
• wherein the gap has a concave space over the through-hole and between the first layer and the second layer.