US 9,865,787 B2 · Chip substrate and chip package module

Abstract

A chip substrate includes conductive portions, insulation portions, cavities and a heat dissipating portion. The insulation portions are alternately bonded to the conductive portions to electrically isolate the conductive portions. The lens insertion portions are formed on an upper surface of the chip substrate at a predetermined depth so as to extend across each of the insulation portions. Each of the lens insertion portions includes a predetermined number of straight sides and a predetermined number of arc-shaped corners formed in regions where the straight sides meet with each other. The cavities are formed inward of the lens insertion portions at a predetermined depth so as to extend across each of the insulation portions. The heat dissipating portion is bonded to a lower surface of the chip substrate.

Claims10

Dependent claims

A chip substrate, comprising:

conductive portions;
insulation portions to electrically isolate the conductive portions from one another;
lens insertion grooves formed at an upper surface, each of the lens insertion grooves having a first predetermined depth, an outer periphery of each of the lens insertion grooves being generally shaped as a polygon with a plurality of straight sides whose corners are arc-shaped;
cavities further depressed from the lens insertion grooves with a second predetermined depth, each of the cavities having a bottom surface wherein one of the insulation portions is exposed at the bottom surface of each of the cavities;
and
a heat dissipating portion bonded to a lower.

3 more elements

Dependencies are inferred from the claim text.

Chip substrate and chip package module

Life of this patent

Chip substrate and chip package module

Life of this patent

Abstract

Claims10