Optoelectronic component and method of production thereof

An optoelectronic component comprising:

• a lead frame subdivided by a separating region into a first lead frame part and a second lead frame part;
• a molded body that embeds the lead frame and forms a package having a cavity that exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, at least one trench structure which is used as an alignment structure being provided on the upper side of the exposed region of the first lead frame part;
• and
• at least one optoelectronic semiconductor chip that generates light radiation arranged on the upper side of the exposed region of the first lead frame part,
• wherein the trench structure comprises an island region forming at least one straight edge with the trench structure,
• the at least one straight edge is configured as an alignment structure and extends parallel to a main axis of the component, and
• the island region is configured rectangularly and extends beyond the cavity under the molded body.

An optoelectronic component comprising:

• a lead frame subdivided by a separating region into a first lead frame part and a second lead frame part;
• a molded body that embeds the lead frame and forms a package having a cavity that exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, at least one trench structure used as an alignment structure being provided on the upper side of the exposed region of the first lead frame part, wherein the separating region and the trench structure are filled molding material, and the cavity is subdivided into three sections by two bar-shaped structures;
• and
• at least one optoelectronic semiconductor chip that generates light radiation, arranged on the upper side of the exposed region of the first lead frame part,
• wherein the trench structure comprises an island region forming at least one straight edge with the trench structure,
• the at least one straight edge is configured as an alignment structure and extends parallel to a main axis of the component, and
• the island region is configured rectangularly and extends beyond the cavity under the molded body.