Methods of manufacturing the package and light-emitting device
AssigneeNichia Corporation
InventorsTadaaki Ikeda, Masaki Hayashi, Koji Abe, Kimihiro Miyamoto
Life of this patent
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Abstract
A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.
Claims10
A method of manufacturing a package, the method comprising the steps of:
- preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads;
- forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess;
- removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed;
- and
- wherein in the step of removing the reflective film, a voltage is applied to the resin compact while the resin compact is immersed in electrolyte solution to peel the reflective film from the pair of the leads.
A method of manufacturing of a light-emitting device, the method comprising the steps of:
- preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads;
- forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess;
- removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed;
- disposing a light emitting element on at least one of the pair of leads on which the reflective film has been removed;
- and
- wherein in the step of removing the reflective film, a voltage is applied to the resin compact while the resin compact is immersed in electrolyte solution to peel the reflective film from the pair of the leads.
Dependencies are inferred from the claim text.