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US 9,865,769 B2Granted
Back contact LED through spalling
AssigneeInternational Business Machines Corporation
InventorsCan Bayram, Stephen W. Bedell, Ning Li, Devendra K. Sadana, Kuen-Ting Shiu
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Abstract
A method of forming, and corresponding structure, of an LED device where an LED and the contacts for the device are formed on a surface of the substrate, and the substrate is spalled just below the surface of the substrate.
Claims20
A method of forming an LED device, the method comprising:
- forming an LED structure on a substrate;
- forming a first contact on the substrate;
- forming a second contact on the LED structure;
- forming a stressor layer over the LED structure, the first contact, the second contact and the substrate;
- spalling the substrate, wherein spalling propagates a fracture in the substrate.
2 more elements
An LED device, the LED device comprising:
- a spalled substrate, wherein the spalled substrate has a spalled surface and a top surface located on the opposite side of the spalled surface;
- an LED structure located on the top surface of the spalled substrate;
- a first contact located on the top surface of the spalled substrate;
- and
- a second contact located on the LED structure.
2 more elements
Dependencies are inferred from the claim text.