Package structure with optical barrier, optical package structure and manufacturing methods thereof
AssigneeSensoTek technology Corp.
InventorsFeng-Jung Hsu, Chu-Yuan Yang, Yuan-Ching Hsu, Yi-Hua Chang
Life of this patent
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Abstract
A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.
Claims13
A package structure with an optical barrier, comprising:
- a substrate;
- an emitter for emitting disposed on the substrate;
- a detector for receiving the optical signal disposed on the substrate;
- an optical barrier disposed between the emitter and the detector for shielding the excess optical signal, wherein the optical barrier comprises sidewalls and a top surface;
- and
- a package material used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material, wherein the package material is in direct contact with the top surface and the sidewalls of the optical barrier, and wherein the package material is in direct contact with the substrate, wherein a half emitting angle of emitter is smaller than 30 degrees.
A package structure with an optical barrier, comprising:
- a substrate;
- an emitter for emitting disposed on the substrate;
- a detector for receiving the optical signal disposed on the substrate;
- an optical barrier disposed between the emitter and the detector for shielding the excess optical signal, wherein the optical barrier comprises sidewalls and a top surface;
- and
- a package material used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material, wherein the package material is in direct contact with the top surface and the sidewalls of the optical barrier, and wherein the package material is in direct contact with the substrate, wherein the distance between a top surface of the emitter and the package material is larger than 50 μm.
A method for forming optical package structure, comprising:
- providing a substrate, having an emitter for emitting and a detector for receiving the optical signal disposed thereon, and an optical barrier disposed between the emitter and the detector for shielding the excess optical signal disposed on the substrate, wherein the optical barrier comprises sidewalls and a top surface;
- and
- using a package material to completely cover the optical barrier, the emitter and the detector, wherein the package material is in direct contact with the top surface and the sidewalls of the optical barrier, and wherein the package material is in direct contact with the substrate, wherein a half emitting angle of emitter is smaller than 30 degrees.
A method for forming optical package structure, comprising:
- providing a pre-substrate, having an optical barrier disposed thereon, wherein the optical barrier is structurally integrally formed with the pre-substrate, wherein the optical barrier comprises sidewalls and a top surface;
- performing a die attachment process, to bond the emitter and the detector on the pre-substate;
- and
- using a package material to completely cover the optical barrier, the emitter and the detector, wherein the package material is in direct contact with the top surface and the sidewalls of the optical barrier, and wherein the package material is in direct contact with the substrate.
Dependencies are inferred from the claim text.