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US 9,865,733 B2Granted
Metal oxide semiconductor having epitaxial source drain regions and a method of manufacturing same using dummy gate process
AssigneeSony Corporation
InventorYasushi Tateshita
Life of this patent
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Abstract
A semiconductor device in which sufficient stress can be applied to a channel region due to lattice constant differences.
Claims14
A semiconductor device comprising:
- a silicon substrate;
- a gate electrode over the silicon substrate;
- a gate insulating film between the gate electrode and the silicon substrate, the gate insulating film at least including hafnium;
- as viewed in cross section, an offset spacer between a sidewall film and the gate electrode;
- a source/drain region in the substrate, the source/drain region having a lattice constant different from a lattice constant of silicon substrate;
- a work function control film between the gate insulating film and the gate electrode;
- as viewed in the cross section, a first insulating film on both of oppositely facing sides of the gate electrode;
- and
- as viewed in the cross section, a second insulating film contacting at least a portion of a top surface of the gate electrode.
6 more elements
Dependencies are inferred from the claim text.