Semiconductor memory device
AssigneeToshiba Memory Corporation
InventorsTakahisa Kanemura, Takashi Izumida
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AssigneeToshiba Memory Corporation
InventorsTakahisa Kanemura, Takashi Izumida
Estimating the term…
A semiconductor memory device according to an embodiment includes a memory cell array that includes a plurality of memory cells. The memory cell array comprises: a plurality of first conductive layers that are stacked in a first direction above a substrate and extend in a second direction intersecting the first direction; a second conductive layer extending in the first direction; a variable resistance film provided at intersections of the plurality of first conductive layers and the second conductive layer; a first select transistor disposed closer to a side of the substrate than a lowermost layer of the plurality of first conductive layers, the first select transistor including a first select gate line intersecting the second conductive layer; a third conductive layer that extends in a third direction intersecting the second direction and is connected to a lower end of the second conductive layer via the first select transistor; and a second select transistor disposed between at least one pair of the plurality of first conductive layers adjacent in the first direction, the second select transistor including a second select gate line intersecting the second conductive layer.
A semiconductor memory device, including a memory cell array, the memory cell array including a plurality of memory cells, the memory cell array comprising:
Dependencies are inferred from the claim text.