Solid-state imaging device, manufacturing method therefor, and imaging apparatus

A solid-state imaging device comprising:

• a first chip including a pixel array in which a plurality of photoelectric conversion portions converting incident light into an electric signal are disposed, a thickness of the first chip being less than 10 micrometers;
• a second chip having an area in a plan view less than an area of the first chip in the plan view, the second chip being physically connected to the first chip;
• a connection portion disposed between the first chip and the second chip, the connection portion being configured to electrically connect the first chip and the second chip;
• and
• a support portion provided to cover an entire region which is not covered with the second chip in a surface of the first chip connected to the second chip, the support portion being configured to support the first chip so as to maintain flatness of the first chip,
• wherein the first chip includes a test terminal for external connection, and
• the test terminal is provided at a position at which the test terminal does not overlap with the second chip in the plan view of the solid-state imaging device.