Systems and methods for cooling of power electronic devices

A method for cooling a power electronic device comprising:

• providing one or more power transistor components;
• providing one or more capacitor components;
• providing one or more power interconnect buses in electrical communication with the one or more power transistor components and the one or more capacitor components;
• and
• providing one or more heat sink components, wherein the one or more power transistor components and the one or more capacitor components are in direct thermal communication with the one or more heat sink components, and wherein the one or more power transistor components and the one or more capacitor components are each located on substantially opposite sides of the one or more heat sink components, such that heat is transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components, thereby cooling the one or more power transistor components and the one or more capacitor components;
• wherein the one or more power interconnect buses are (1) at least partially wrapped around an outer side of the one or more power transistor components and contacting the one or more power transistor components on a side that is substantially opposite the side of the one or more power transistor component that is in direct thermal communication with the one or more heat sink components, (2) at least partially wrapped around an outer side of the one or more capacitor components and contacting the one or more capacitor components on a side that is substantially opposite the side of the one or more capacitor component that is in direct thermal communication with the one or more heat sink components.