Flexible two-phase cooling system

A flexible two-phase cooling apparatus for cooling microprocessors in servers, the cooling apparatus comprising:

• a primary cooling loop for circulating a dielectric coolant, the primary cooling loop comprising:
• a reservoir;
• a pump downstream of the reservoir;
• an inlet manifold downstream of the pump;
• an outlet manifold downstream of the inlet manifold;
• and two or more flexible cooling lines extending from the inlet manifold to the outlet manifold, the two or more flexible cooling lines each being routable within a server housing and each being fluidly connected to two or more series-connected heat sink modules, the two or more flexible cooling lines configured to transport low-pressure two-phase dielectric coolant, each heat sink module comprising a thermally conductive base member sized to cover a top surface of a microprocessor;
• a first bypass comprising a first end and a second end, the first end of the first bypass being connected to the primary cooling loop downstream of the pump and upstream of the inlet manifold, the second end of the first bypass being connected at or upstream of the reservoir, the first bypass comprising a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass;
• and
• a second bypass comprising a first end and a second end, the first end of the second bypass being connected to the inlet manifold, the second end of the second bypass being connected to the outlet manifold, the second bypass comprising a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.