Unit for semiconductor device

A unit for a semiconductor device, comprising:

• an insulating substrate having a first conductive pattern formed on one surface thereof and a second conductive pattern formed on the other surface which is a side opposite to the one surface across the insulating substrate;
• a first conductive block formed on the first conductive pattern;
• a second conductive block formed on the second conductive pattern so that the second conductive block is arranged on a side opposite to the first conductive block across the insulating substrate;
• a semiconductor chip having one surface fixed to the second conductive block;
• a plurality of implant pins fixed to the other surface of the semiconductor chip;
• a printed circuit board having a third conductive pattern formed thereon and the implant pins fixed thereon;
• a first external lead terminal fixed to the second conductive block;
• a second external lead terminal fixed to the third conductive pattern and electrically connected to the implant pins;
• and
• a resin case covering the first conductive block, the second conductive block, and the insulating substrate, and sealing such that the first conductive block is exposed from a first surface of the resin case and ends of the first and second external lead terminals protrude from a second surface at an opposite side of the first surface.