Display apparatus
AssigneeAu Optronics Corporation
InventorsWen-Hung Huang, Tung-Shin Lin, Cheng-Min Tsai
Life of this patent
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Abstract
A display apparatus includes a frame, a panel module and an adjusting pad. The frame has a supporting surface, and the panel module includes a substrate and a plurality of chips. The substrate is disposed on the supporting surface and has a bonding region at a side of the substrate. The chips are disposed on the bonding region, wherein the chips and the supporting surface are located at two opposite surfaces of the substrate. The adjusting pad is disposed between the supporting surface and the bonding region, and the thickness of the adjusting pad is gradually reduced from a center portion of the adjusting pad toward two sides of the adjusting pad. Another display apparatus, in which a frame and an adjusting pad are integrated into one piece, is provided.
Claims17
A display apparatus comprising:
- a frame having a supporting surface;
- a panel module comprising:
- a substrate disposed on the supporting surface and the substrate having a bonding region at a side thereof;
- and
- a plurality of chips disposed on the bonding region, wherein the chips and the bonding region are located on the supporting surface, and the chips and the supporting surface are respectively located at two opposite surfaces of the substrate;
- and
- an adjusting pad disposed between the supporting surface and the bonding region of the substrate, and the thickness of the adjusting pad being gradually reduced from the center toward the two sides thereof, wherein the thickness of the adjusting pad corresponding to the chips disposed at the center of the bonding region is greater than the thickness of the adjusting pad corresponding to the chips disposed at the two sides of the bonding region.
A display apparatus comprising:
- a frame having a supporting surface and a first adjusting pad protruding from the supporting surface;
- and
- a panel module comprising:
- a substrate disposed on the supporting surface and the substrate having a bonding region at a side thereof, and the first adjusting pad disposed between the supporting surface and the bonding region of the substrate;
- and
- a plurality of chips disposed on the bonding region, wherein a projection of the bonding region is located on the supporting surface, and the chips and the supporting surface are respectively located at two opposite surfaces of the substrate;
- and
- a second adjusting pad attached on the supporting surface and located at two sides of the first adjusting pad, wherein the height of the first adjusting pad is greater than the height of the second adjusting pad.
Dependencies are inferred from the claim text.